The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2012

Filed:

Jun. 14, 2005
Applicants:

James David Blackhall Smith, Monroeville, PA (US);

Gary Stevens, Surrey, GB;

John William Wood, Winter Springs, FL (US);

Inventors:

James David Blackhall Smith, Monroeville, PA (US);

Gary Stevens, Surrey, GB;

John William Wood, Winter Springs, FL (US);

Assignee:

Siemens Energy, Inc., Orlando, FL (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 7/12 (2006.01); H01L 23/24 (2006.01);
U.S. Cl.
CPC ...
Abstract

In one embodiment the present invention provides for a high thermal conductivity highly structured resin that comprises a host highly structured resin matrix, and a high thermal conductivity filler. The high thermal conductivity fillers are from 1-1000 nm in length, and high thermal conductivity fillers have an aspect ratio of between 3-100. Particular highly structured highly structured resins include at least one of liquid crystalpolymers, interpenetrating networks, dendrimer type matrices, expanding polymers, ladder polymers, star polymers and structured organic-inorganic hybrids


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