The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Jul. 15, 2009
Young Ah Song, Gyunggi-do, KR;
Young Chang Joo, Seoul, KR;
Ji Hoon Lee, Seoul, KR;
Seol Min Yi, Seoul, KR;
Jae Woo Joung, Gyunggi-do, KR;
Sung IL OH, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
IN Young Kim, Gyunggi-do, KR;
Young Ah Song, Gyunggi-do, KR;
Young Chang Joo, Seoul, KR;
Ji Hoon Lee, Seoul, KR;
Seol Min Yi, Seoul, KR;
Jae Woo Joung, Gyunggi-do, KR;
Sung Il Oh, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
In Young Kim, Gyunggi-do, KR;
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Abstract
Disclosed are a method of forming metal wiring and metal wiring formed using the same. The method includes printing wiring using an ink composition including metallic nanoparticles and dispersants maintaining dispersion of the metallic nanoparticles, performing a first firing process of firing the wiring under vacuum or in an inert atmosphere to suppress grain growth, and performing a second firing process of firing the wiring with the vacuum or inert atmosphere released, to accelerate grain growth. The method of forming metal wiring induces abnormal grain growth by rapidly removing dispersants, capable of inducing the growth of metallic nanoparticles, at a temperature at which the growth force of the metallic nanoparticles is high, in the process of firing the metallic nanoparticles. Accordingly, the metal wiring has a coarse-grained structure containing metallic particles with a large average particle size, and the electrical and mechanical characteristics thereof can be enhanced.