The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2012

Filed:

Dec. 10, 2007
Applicants:

Manoocher Birang, Los Gatos, CA (US);

Kapila P. Wijekoon, Palo Alto, CA (US);

Alexander Sou-kang Ko, Santa Clara, CA (US);

Eugene Rabinovich, Fremont, CA (US);

Inventors:

Manoocher Birang, Los Gatos, CA (US);

Kapila P. Wijekoon, Palo Alto, CA (US);

Alexander Sou-Kang Ko, Santa Clara, CA (US);

Eugene Rabinovich, Fremont, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C25D 1/12 (2006.01);
U.S. Cl.
CPC ...
Abstract

Embodiments of the invention provide a novel apparatus and methods for forming a contact structure having metal lines formed using an electrophoretic deposition process. A substrate having a conductive or semiconductive layer is covered with an insulating layer and patterned to expose the conductive or semiconductive layer. The substrate is exposed to a processing medium comprising charged particles immersed in a dielectric fluid. An electric field is optionally applied. The charged particles deposit onto the exposed portions of the substrate and are then solidified in a reflow process.


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