The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 10, 2012

Filed:

Nov. 16, 2009
Applicants:

David A. Hayner, Austin, TX (US);

Todd F. Miller, Scottsdale, AZ (US);

Inventors:

David A. Hayner, Austin, TX (US);

Todd F. Miller, Scottsdale, AZ (US);

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01B 7/16 (2006.01);
U.S. Cl.
CPC ...
Abstract

Apparatus and methods for applying stress-induced offset compensation and/or scale factor correction in sensor devices are provided. One sensor device () includes an integrated circuit device (), a transducer () coupled to the ASIC device, and a stress sensor () coupled to the transducer or the integrated circuit device and configured to measure stress on the sensor device independent of the transducer. Another sensor device () includes a transducer, a sensor package () enclosing the transducer, and a stress sensor () coupled to the sensor device package and configured to measure stress on the sensor device independent of the transducer. A method includes detecting, via a stress sensor, an amount of stress being applied to the sensor device and adjusting, via the stress sensor and independent of the transducer, an output of the sensor device by the detected amount of stress.


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