The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 10, 2012
Filed:
Feb. 18, 2009
Applicants:
Seok Hwan Ahn, Gyunggi-do, KR;
Young Gwan Ko, Seoul, KR;
Inventors:
Seok Hwan Ahn, Gyunggi-do, KR;
Young Gwan Ko, Seoul, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01J 3/10 (2006.01);
U.S. Cl.
CPC ...
Abstract
Disclosed is a printed circuit board having a plating pattern buried in a via and a method of manufacturing the same. The method of manufacturing the printed circuit board includes forming a negative pattern for forming a plating pattern, thus remarkably reducing the generation of plating thickness deviation in a plating process for forming a circuit pattern, and the printed circuit board has improved electrical signal transmission properties.