The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8213209 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 03, 2012

Filed:

Jun. 29, 2010
Applicants:

Hiroshi Tsuda, Kanagawa, JP;

Yoshitaka Kubota, Kanagawa, JP;

Hiromichi Takaoka, Kanagawa, JP;

Inventors:

Hiroshi Tsuda, Kanagawa, JP;

Yoshitaka Kubota, Kanagawa, JP;

Hiromichi Takaoka, Kanagawa, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11C 5/00 (2006.01); G11C 17/18 (2006.01); G11C 8/00 (2006.01); H01L 23/52 (2006.01); H01L 21/336 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a method of manufacturing a semiconductor device, element properties of an element property extraction pattern formed on a semiconductor wafer is extracted as element properties of a current control element corresponding to the element property extraction pattern. A supply energy to the current control element is set which is formed between nodes on the semiconductor wafer, based on the extracted element properties. The set supply energy is supplied to the current control element to irreversible control an electrical connection between the nodes through the device breakdown by the current control element.


Find Patent Forward Citations

Tsuda, Hiroshi. (2012). Method of manufacturing semiconductor device and semiconductor device (U.S. Patent No. 8213209). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8213209

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