The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Oct. 29, 2008
Applicants:

Yasuji Kusuda, Kyoto, JP;

Takeshi Asakura, Kyoto, JP;

Koji Okamoto, Kyoto, JP;

Toshiyuki Iwai, Kyoto, JP;

Inventors:

Yasuji Kusuda, Kyoto, JP;

Takeshi Asakura, Kyoto, JP;

Koji Okamoto, Kyoto, JP;

Toshiyuki Iwai, Kyoto, JP;

Assignee:
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G06F 3/041 (2006.01); G06F 3/045 (2006.01); G06F 3/042 (2006.01); G06F 3/043 (2006.01); G06F 3/044 (2006.01); G06F 3/046 (2006.01); G06F 1/16 (2006.01); G06K 11/06 (2006.01); G08C 21/00 (2006.01); H05K 5/00 (2006.01); H05K 7/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

There are included a protection panel main body configured by a transparent plate, a lower electrode sheet laminated onto an upper surface of the protection panel main body, an upper electrode sheet bonded to the lower electrode sheet at peripheral edges thereof with a gap being formed between electrodes, a decorative sheet laminated onto an upper surface of the upper electrode sheet, and an FPC that has an end inserted between the lower electrode sheet and the upper electrode sheet and is connected by thermal compression bonding to output ends of an upper circuit and a lower circuit. Further, the protection panel main body is provided with a thermal compression head inserting space at a portion corresponding to a portion bonded with the FPC by thermal compression so that a thermal compression heater is allowed to be brought closer to the lower electrode sheet.


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