The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Sep. 01, 2010
Applicant:

Yasuo Yamasaki, Shiojiri, JP;

Inventor:

Yasuo Yamasaki, Shiojiri, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/498 (2006.01); H01L 21/68 (2006.01); H01L 21/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

A semiconductor device having a multi-layered wiring layer includes a semiconductor substrate, an electrode that is provided on the semiconductor substrate, an insulating film that is provided on the semiconductor substrate, the insulating film having an aperture at least partly overlapping the electrode, a resin bump that is provided on the insulating film, and the wiring layer that is electrically connected to the electrode and that includes a first conductive layer, an intermediate layer, and a second conductive layer. The first conductive layer is formed on the electrode and on the resin bump, the intermediate layer is formed on the first conductive layer, and the second conductive layer formed on the intermediate layer.


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