The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Oct. 23, 2006
Applicants:

Yukinari Harimoto, Hadano, JP;

Maki Itoh, Tokyo, JP;

Dimitris Elias Katsoulis, Midland, MI (US);

Inventors:

Yukinari Harimoto, Hadano, JP;

Maki Itoh, Tokyo, JP;

Dimitris Elias Katsoulis, Midland, MI (US);

Assignees:

Dow Corning Toray Company, Ltd., Chiyoda-ku, Tokyo, JP;

Dow Corning Corporation, Midland, MI (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 77/12 (2006.01); B05D 5/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing an inorganic substrate coated with a thin silica type glass layer of 2H to 9H pencil hardness, said method comprising the steps of: coating an inorganic substrate with a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula, and curing it; an inorganic substrate coated with a thin silica type glass layer; a coating agent for an inorganic substrate that is composed of a cyclic dihydrogenpolysiloxane and/or a hydrogenpolysiloxane represented by a specific unit formula; and a semiconductor device having an inorganic substrate coated with a thin silica type glass layer.


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