The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Mar. 23, 2007
Yukihito Zanka, Mie, JP;
Yuji Ryosho, Mie, JP;
Ken Shimizu, Mie, JP;
Masashi Shimouse, Mie, JP;
Shigeo Mizukami, Mie, JP;
Yukihito Zanka, Mie, JP;
Yuji Ryosho, Mie, JP;
Ken Shimizu, Mie, JP;
Masashi Shimouse, Mie, JP;
Shigeo Mizukami, Mie, JP;
Japan Polypropylene Corporation, Tokyo, JP;
Abstract
A moldability modifier capable of improving molding processability, and a polypropylene resin composition using the same suitable for automobile exterior parts are provided. The invention relates to a moldability modifier comprising propylene block copolymer (A) containing from 80 to 98 wt % of a propylene homopolymer portion (A1) and from 2 to 20 wt % of a propylene/ethylene random copolymer portion (A2), wherein the MFR of (A1) is 300 g/10 min or more, the ethylene content of (A2) is from 10 to 70 wt %, the [η] of (A2) is 6.5 dl/g or more, and the MFR as a whole is 40 g/10 min or more; and propylene block copolymer (B) containing from 20 to 79 wt % of a propylene polymer portion (B1) and from 21 to 80 wt % of a propylene/ethylene random copolymer portion (B2), wherein the MFR of (B1) is 20 g/10 min or more, the ethylene content of (B2) is from 20 to 70 wt %, the [η] of (B2) is from 2.5 to 9.0 dl/g, and the MFR as a whole is from 0.1 to 50 g/10 min; and a polypropylene resin composition using the same.