The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Mar. 28, 2008
Applicants:

Takanori Yamashita, Tokyo, JP;

Masataka Okushita, Tokyo, JP;

Hirohisa Akita, Tokyo, JP;

Hiroshi Hoya, Chiba, JP;

Inventors:

Takanori Yamashita, Tokyo, JP;

Masataka Okushita, Tokyo, JP;

Hirohisa Akita, Tokyo, JP;

Hiroshi Hoya, Chiba, JP;

Assignees:

Dai Nippon Printing Co., Ltd., Shinjuku-ku, Tokyo, JP;

Mitsui Chemicals, Inc., Minato-ku, Tokyo, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01M 6/00 (2006.01); H01M 10/00 (2006.01); H01M 2/00 (2006.01); H01M 2/02 (2006.01); H01M 2/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

In a packaging material for electrochemical cell, a thermally adhesive resin layer is configured of a resin having a propylene based elastomer resin in a propylene based resin. This propylene based elastomer resin is a copolymer composed of a constitutional unit derived from propylene and a constitutional unit derived from an α-olefin having from 2 to 20 carbon atoms; when the total sum of the constitutional unit derived from propylene and the constitutional unit derived from an α-olefin is defined as 100% by mole, contains 50% by mole or more of the constitutional unit derived from propylene; and is satisfied with (a) a Shore A hardness (ASTM D2240) of from 65 to 90, (b) a melting point of from 130 to 170° C., (c) a density (ASTM D1505) of from 860 to 875 kg/mand (d) a glass transition temperature as measured by DSC of from −25° C. to −35° C.


Find Patent Forward Citations

Loading…