The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8211540 B1

PDF
Full Text
Expired
Date of Patent:
Jul. 03, 2012

Filed:

Oct. 08, 2008
Applicants:

Yong Woo Hong, Suwon-si, KR;

Ki Seong Jung, Gunpo-si, KR;

Wan Jung Kim, Seoul, KR;

Su MI Im, Gunpo-si, KR;

Sang Jin Kim, Gunpo-si, KR;

Chang Beom Chung, Yongin-si, KR;

Inventors:

Yong Woo Hong, Suwon-si, KR;

Ki Seong Jung, Gunpo-si, KR;

Wan Jung Kim, Seoul, KR;

Su Mi Im, Gunpo-si, KR;

Sang Jin Kim, Gunpo-si, KR;

Chang Beom Chung, Yongin-si, KR;

Assignee:

Cheil Industries, Inc., Gumi-si, Gyeongsangbuk-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B32B 27/38 (2006.01); B32B 27/26 (2006.01); C08L 13/00 (2006.01); C08L 15/00 (2006.01); C08L 63/00 (2006.01); H01L 23/02 (2006.01); H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An adhesive film composition includes an elastomer resin having one or more of a hydroxy group, a carboxyl group, or an epoxy group, a film-forming resin, a silylated phenolic curing resin, an epoxy resin, a curing accelerator, and a filler.


Find Patent Forward Citations

Hong, Yong. (2012). Adhesive film composition, associated dicing die bonding film, die package, and associated methods (U.S. Patent No. 8211540). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8211540

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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