The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Apr. 11, 2008
Yasuyuki Yokoe, Shizuoka, JP;
Toru Kaneko, Shizuoka, JP;
Hiroshi Numata, Shizuoka, JP;
Takeshi Shimada, Shizuoka, JP;
Yasuyuki Yokoe, Shizuoka, JP;
Toru Kaneko, Shizuoka, JP;
Hiroshi Numata, Shizuoka, JP;
Takeshi Shimada, Shizuoka, JP;
Toho Tenax Co., Ltd., Tokyo, JP;
Abstract
The present invention discloses a resin composition and a prepreg produced using the resin composition. The resin composition comprises, as essential components: 100 parts by mass of a component (A) which is an epoxy resin; 41 to 80 parts by mass of a component (B) which is thermoplastic resin particles; and 20 to 50 parts by mass (in terms of diaminodiphenylsulfone) of a component (C) which is diaminodiphenylsulfone microencapsulated with a coating agent. The thermoplastic resin particles (B) comprise at least thermoplastic resin particles (B) having an average particle diameter of 1 to 50 μm and thermoplastic resin particles (B) having an average particle diameter of 2 to 100 μm at a mass ratio of 3:1 to 1:3. The average particle diameter ratio D/Dof the average particle diameter Dof the thermoplastic resin particles (B) to the average particle diameter Dof the thermoplastic resin particles (B) is 2 or more.