The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Apr. 29, 2008
Graham M. Bates, Waterbury, VT (US);
David Domina, Cambridge, VT (US);
James L. Hardy, Jr., Essex Junction, VT (US);
Eric J. White, Charlotte, VT (US);
Graham M. Bates, Waterbury, VT (US);
David Domina, Cambridge, VT (US);
James L. Hardy, Jr., Essex Junction, VT (US);
Eric J. White, Charlotte, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A patterned portion of a patterned semiconductor substrate is removed by abrasive mechanical planarization employing an abrasive pad but without employing any slurry. Preferably, water is supplied to enhance the removal rate during the mechanical planarization. The removal rate of material is substantially independent for common materials employed in back-end-of-line (BEOL) semiconductor materials, which enables non-selective removal of the material containing metallization structures. The removal rate of silicon is lower than the removal rate for the BEOL semiconductor materials, enabling a self-stopping planarization process.