The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 03, 2012
Filed:
Sep. 16, 2010
Karl S Weibezahn, Corvallis, OR (US);
Karl S Weibezahn, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
Methods and apparatus are provided for solder bonding entities to solid materials. One or more through apertures are formed in a solid material. Solder paste is introduced into each through aperture. Respective entities having solderable surface features are disposed in overlying alignment with the through apertures. The arrangement is heated causing molten solder paste to wet the solderable surface features and the solid material. Cooling results in the electrical and mechanical bonding of the entities to the solid material. Devices having substantially planar form factors and without lead wires can be electrically and mechanically secured to a supporting conductive stratum.