The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 03, 2012

Filed:

Aug. 28, 2009
Applicants:

Hidekazu Sato, Tokyo, JP;

Masazumi Arata, Tokyo, JP;

Kunio Oda, Tokyo, JP;

Yoshimitsu Satoh, Tokyo, JP;

Inventors:

Hidekazu Sato, Tokyo, JP;

Masazumi Arata, Tokyo, JP;

Kunio Oda, Tokyo, JP;

Yoshimitsu Satoh, Tokyo, JP;

Assignee:

TDK Corporation, Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/06 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of A production method including interdiffusion of a Ni component in a magnetic layer and a Zn component in a nonmagnetic sheet to form an interdiffusion layer in a region of the nonmagnetic sheet inside a conductive pattern. This method allows the interdiffusion layer to be formed without need for complicated processing of the nonmagnetic sheet. Furthermore, there is no boundary region between the magnetic layer and the nonmagnetic sheet around it. The nonmagnetic layer is located between turns of a coiled conductor to suppress degradation of dc bias characteristics and a magnetic body penetrates in a region inside the coiled conductor to suppress reduction in inductance due to provision of the nonmagnetic layer between turns of the coiled conductor.


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