The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jun. 27, 2008
David Daomin Zhou, Saugus, CA (US);
Robert J. Greenberg, Los Angeles, CA (US);
Jordan Matthew Neysmith, Pasadena, CA (US);
Boon-khai NG, Alhambra, CA (US);
James Singleton Little, Saugus, CA (US);
Neil Hamilton Talbot, La Crescenta, CA (US);
Satinderpall Singh Pannu, Pleasanton, CA (US);
James Courtney Davidson, Livermore, CA (US);
Phillipe John Tabada, Roseville, CA (US);
Melody Tabada, Legal Representative, Roseville, CA (US);
David Daomin Zhou, Saugus, CA (US);
Robert J. Greenberg, Los Angeles, CA (US);
Jordan Matthew Neysmith, Pasadena, CA (US);
Boon-Khai Ng, Alhambra, CA (US);
James Singleton Little, Saugus, CA (US);
Neil Hamilton Talbot, La Crescenta, CA (US);
Satinderpall Singh Pannu, Pleasanton, CA (US);
James Courtney Davidson, Livermore, CA (US);
Phillipe John Tabada, Roseville, CA (US);
Melody Tabada, legal representative, Roseville, CA (US);
Second Sight Medical Products, Inc., Sylmar, CA (US);
Abstract
A flexible circuit electrode array and method of fabrication having a polymer base layer; metal traces deposited on the polymer base layer, including electrodes to stimulate tissue; a polymer top layer deposited on the polymer base layer and metal traces; and a coating of the base and top layer by a soft polymer. A method of preparing a flexible circuit electrode array, comprising: providing a first soft polymer layer; depositing a first a base layer on the first soft polymer layer; providing a metal thin film on the base layer; depositing a top polymer layer on the metal thin film; providing holes in the top polymer layer; depositing a second soft polymer layer on the top polymer layer; providing holes in the second soft polymer layer for bond pads and electrodes; and preparing electrodes in the provided holes.