The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Jun. 29, 2009
Applicants:

Canhua Chen, DongGuan, CN;

Hiroshi Fukaya, Hong Kong, CN;

Yiusing Ho, Hong Kong, CN;

Inventors:

Canhua Chen, DongGuan, CN;

Hiroshi Fukaya, Hong Kong, CN;

Yiusing Ho, Hong Kong, CN;

Assignee:

SAE Magnetics (H.K.) Ltd., Hong Kong, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 21/21 (2006.01);
U.S. Cl.
CPC ...
Abstract

A dimple forming apparatus for forming dimple on a workpiece at a desired position comprises a base mold with a concave surface, a heating unit and a forming pin with a spherical surface. The base mold is configured to be positioned below the workpiece. The heating unit is configured to heat the desired position of the workpiece for enhancing tractility of the desired position of the workpiece, and the forming pin is configured to be positioned above workpiece with the spherical surface of the forming pin aiming toward the desired position of the workpiece heated by the heating unit. The heating unit successfully enhances the tractility of desired position of the workpiece before the desired position of the workpiece is punched by the forming pin, and produces low stress at the junction of the dimple formed by the forming pin punching and the workpiece of the workpiece. The present invention also discloses a dimple forming method, a head gimbal assembly and a method for manufacturing a head gimbal assembly.


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