The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Mar. 19, 2010
Applicants:

Kenji Sakata, Kanagawa, JP;

Tsuyoshi Kida, Kanagawa, JP;

Inventors:

Kenji Sakata, Kanagawa, JP;

Tsuyoshi Kida, Kanagawa, JP;

Assignee:

Renesas Electronics Corporation, Kawasaki-shi, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/29 (2006.01);
U.S. Cl.
CPC ...
Abstract

The extent of a bow of a semiconductor device is suppressed in a case where the fillet width of an underfill resin is asymmetrical. The center positionof a chipis caused to deviate from the center positionof a wiring substratein a direction (the direction of the arrow B) reverse to the deviation direction (the direction of the arrow A) of the center positionof an underfill resinfrom the center positionof the chip. The center positionof a resin for encapsulationis caused to deviate from the center positionof the wiring substratein the same direction (the direction of the arrow A) as the deviation direction (the direction of the arrow A) of the center positionof the underfill resinfrom the center positionof the chip


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