The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Jan. 25, 2010
Applicants:
Kazumichi Shimizu, Osaka, JP;
Yoshihiro Tomura, Osaka, JP;
Masahiro Ono, Osaka, JP;
Inventors:
Assignee:
Panasonic Corporation, Osaka, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
This semiconductor device is a semiconductor device in which a semiconductor element is flip-chip mounted onto a circuit substrate and the semiconductor element is covered and sealed with a sealing resin. A recess portion is formed in the sealing resin on a surface opposite to the mounting surface of the semiconductor element. Warping of the semiconductor device is reduced by the action of this recess portion.