The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Sep. 16, 2009
Kiyoshi Sato, Niigata-Ken, JP;
Kiyoshi Kobayashi, Niigata-Ken, JP;
Yoshitaka Uto, Niigata-Ken, JP;
Katsuya Kikuiri, Niigata-Ken, JP;
Kazuyoshi Takahashi, Niigata-Ken, JP;
Jun Suzuki, Niigata-Ken, JP;
Hideki Gochou, Niigata-Ken, JP;
Toru Takahashi, Niigata-Ken, JP;
Hisanobu Ohkawa, Niigata-Ken, JP;
Kiyoshi Sato, Niigata-Ken, JP;
Kiyoshi Kobayashi, Niigata-Ken, JP;
Yoshitaka Uto, Niigata-Ken, JP;
Katsuya Kikuiri, Niigata-Ken, JP;
Kazuyoshi Takahashi, Niigata-Ken, JP;
Jun Suzuki, Niigata-Ken, JP;
Hideki Gochou, Niigata-Ken, JP;
Toru Takahashi, Niigata-Ken, JP;
Hisanobu Ohkawa, Niigata-Ken, JP;
Alps Electric Co., Ltd., Tokyo, JP;
Abstract
A MEMS sensor includes a first substrate; a second substrate; a movable electrode portion and a fixed electrode portion which are arranged between the first substrate and the second substrate, wherein: conductive supporting portions of the movable electrode portion and the fixed electrode portion are, respectively, fixedly secured to a surface of the first substrate via a first insulating layer; a second insulating layer, a lead layer buried into the second insulating layer, and connection electrode portions that are electrically connected to the lead layer to be individually connected to the conductive supporting portions are provided on a surface of the second substrate; a metallic connection layer is formed on the surface of one of the respective conductive supporting portions; one of the respective connection electrode portions and the metallic connection layer are bonded together by eutectic bonding or diffusion bonding; and, at least each of the connection electrode portions has a thickness of about 4 μm or smaller.