The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Mar. 07, 2006
Applicants:

Boris Regaard, Ypsilanti, MI (US);

Anas Moalem, Hannover, DE;

Jan Michel, Meerbusch, DE;

Peter Abels, Alsdorf, DE;

Stefan Kaierle, Herzogenrath, DE;

Wolfgang Schulz, Langerwehe, DE;

Inventors:

Boris Regaard, Ypsilanti, MI (US);

Anas Moalem, Hannover, DE;

Jan Michel, Meerbusch, DE;

Peter Abels, Alsdorf, DE;

Stefan Kaierle, Herzogenrath, DE;

Wolfgang Schulz, Langerwehe, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23K 26/03 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention relates to a method for measuring phase boundaries of a material during the machining of a workpiece () with a machining beam, more preferably with a laser beam, and a device that is embodied in such a way as to carry out the method. According to said method, during the machining, a machining region () containing the impact point of the machining beam () on the workpiece () is illuminated at least approximately coaxially to the machining beam () by means of additional optical radiation (). Radiation () reflected by the machining region () is detected, parallel to an incidence direction of the optical radiation () or at small angle thereto, by means of an optical detector with local resolution, in order to obtain an optical reflection pattern of the machining region (). From the optical reflection pattern, a course of at least one liquid/solid phase boundary in the machining region () is then determined in an automated manner by means of an image processing algorithm on the basis of a transition from an area containing a large-surface homogeneous area and an area containing a plurality of small-surface homogeneous areas in the optical reflection pattern.


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