The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Jul. 10, 2008
Applicants:

Minoru Souma, Yokohama, JP;

Katsumi Morohoshi, Yokohama, JP;

Tomohiro Itou, Yokohama, JP;

Yasuaki Kai, Yokohama, JP;

Hironobu Muramatsu, Yokohama, JP;

Takashi Oda, Ebina, JP;

Haruo Unno, Yokosuka, JP;

Kenji Uesugi, Miura, JP;

Inventors:

Minoru Souma, Yokohama, JP;

Katsumi Morohoshi, Yokohama, JP;

Tomohiro Itou, Yokohama, JP;

Yasuaki Kai, Yokohama, JP;

Hironobu Muramatsu, Yokohama, JP;

Takashi Oda, Ebina, JP;

Haruo Unno, Yokosuka, JP;

Kenji Uesugi, Miura, JP;

Assignee:

Nissan Motor Co., Ltd., Yokohama-shi, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C08K 5/42 (2006.01); C08K 3/18 (2006.01);
U.S. Cl.
CPC ...
Abstract

There is provided a polycarbonate resin composition containing aluminum oxide nanoparticles and being capable of showing good moldability and retention heat stability and combining high transparency and dimensional stability with excellent mechanical properties. The polycarbonate resin composition is characterized by containing an organic acid and aluminum oxide and in that: the resin composition has a melt mass flow rate of 11 g/10 min or higher as measured according to JIS K 7210 under the conditions of a temperature of 280° C., a nominal load of 2.16 Kg and a nozzle dimension L/D of 8/2; and a No. 2 dumbbell-shaped specimen according to JIS K 7113 formed by heat-press molding the resin composition into a film of 0.2 mm in thickness and cutting the film has a breaking stress of 8 MPa or higher as measured under the conditions of a temperature of 23° C., a humidity of 50% RH and a tensile rate of 50 mm/min. The organic acid is preferably an organic sulfonic acid having a carbon number of 8 or greater, more preferably the one containing an aromatic ring in the molecule.


Find Patent Forward Citations

Loading…