The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Mar. 12, 2007
Tetsuji Ohta, Tokyo, JP;
Mitsuhiro Watanabe, Yokosuka-shi, JP;
Tetsuji Ohta, Tokyo, JP;
Mitsuhiro Watanabe, Yokosuka-shi, JP;
Kimoto Co., Ltd., , JP;
Abstract
A material for electroless plating shows good adhesion for a catalyst and does not cause delamination of a catalyst adhering layer from a non-conductive base material in a catalyst adhering step, development step or other step. In a material for electroless plating, having a catalyst adhering layer on a non-conductive base material, the catalyst adhering layer is formed from a hydrophilic and/or water-soluble resin containing hydroxyl group, and a curable layer formed from a resin having hydroxyl group and an isocyanate type compound is provided between the base material and the catalyst adhering layer. The catalyst adhering layer is preferably formed while isocyanate groups of the isocyanate type compound in the curable layer remain.