The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
May. 14, 2008
Applicants:
Hiroki Naito, Yao, JP;
Satoshi Kawanami, Yao, JP;
Katsushi Miki, Yao, JP;
Ikuo Yosejima, Yao, JP;
Kenichi Kitano, Yao, JP;
Inventors:
Hiroki Naito, Yao, JP;
Satoshi Kawanami, Yao, JP;
Katsushi Miki, Yao, JP;
Ikuo Yosejima, Yao, JP;
Kenichi Kitano, Yao, JP;
Assignee:
Matsumoto Yushi-Seiyaku Co., Ltd., Yao-Shi, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08F 2/44 (2006.01);
U.S. Cl.
CPC ...
Abstract
A production method for heat-expandable microspheres, which have high expanding ratio and are thermally expanded into hollow particulates having excellent repeated-compression durability, and application thereof are provided. The method produces heat-expandable microspheres a shell of thermoplastic resin and a blowing agent being encapsulated therein and having a boiling point not higher than the softening point of the thermoplastic resin.