The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 26, 2012

Filed:

Nov. 14, 2005
Applicants:

Peter E. Leibfried, Vernon, CT (US);

John P. Arrigoni, Wallingford, CT (US);

Dale A. Simard, Terryville, CT (US);

Philip J. Dunne, Thomaston, CT (US);

William G. Sorvillo, Sr., Middletown, CT (US);

Inventors:

Peter E. Leibfried, Vernon, CT (US);

John P. Arrigoni, Wallingford, CT (US);

Dale A. Simard, Terryville, CT (US);

Philip J. Dunne, Thomaston, CT (US);

William G. Sorvillo, Sr., Middletown, CT (US);

Assignee:

United Technologies Corporation, Hartford, CT (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B23P 6/00 (2006.01); B23P 19/04 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for repairing a component having first and second major surfaces, a thickness between the major surfaces, and an edge, is characterized by utilizing a template to determine if the component is suitable for repair, and forming a slot cut entirely through the thickness of the component. The slot extends inward from the edge of the component, has an open end at the edge of the component, a closed end within the component, a width, a radius at the closed end, and chamfered edges at the open end. Forming the slot includes forming an initial cut with a first cutting surface from the edge of the component at least to the defect, finishing the initial cut to the width and the radius with a second cutting surface, resulting in a finished cut, and chamfering the edge of the finished cut with a third cutting surface.


Find Patent Forward Citations

Loading…