The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 26, 2012
Filed:
Nov. 13, 2006
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Kazuhiro Nishikawa, Osaka, JP;
Kunio Hibino, Osaka, JP;
Hidenori Miyakawa, Osaka, JP;
Atsushi Yamaguchi, Osaka, JP;
Kazuhiro Nishikawa, Osaka, JP;
Kunio Hibino, Osaka, JP;
Panasonic Corporation, Osaka, JP;
Abstract
A method for manufacturing a circuit board on which an electronic component is mounted, includes at least the steps of (a) supplying a liquid photo-polymerizable adhesive containing conductive particles dispersed therein to a surface of a printed board, to form an adhesive layer on the board surface; (b) irradiating the photo-polymerizable adhesive with ultraviolet light to turn into a gel, to provide adhesiveness to the adhesive layer; and (c) pressing the electronic component against the component mounting portion of the printed board from an upper surface side of the adhesive layer, to form an electrical connection between the electronic component and the component mounting portion, and in the method, the photo-polymerizable adhesive is a delayed reactive adhesive.