The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 19, 2012

Filed:

Sep. 09, 2011
Applicants:

Sang Hoon Kim, Gunpo-si, KR;

Han Seo Cho, Daejeon-si, KR;

Jae Hyun Jung, Ansan-si, KR;

Joon Sung Kim, Suwon-si, KR;

Inventors:

Sang Hoon Kim, Gunpo-si, KR;

Han Seo Cho, Daejeon-si, KR;

Jae Hyun Jung, Ansan-si, KR;

Joon Sung Kim, Suwon-si, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02B 6/12 (2006.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of manufacturing a printed circuit board for optical waveguides, including: preparing a base substrate; forming an optical waveguide, which includes a lower clad, a core formed on an upper middle of the lower clad, and an upper clad formed on the lower clad to surround an upper surface and a side surface of the core, on an upper middle of the base substrate; disposing a side substrate including a first side substrate that has a through hole, through which the optical waveguide penetrates, provided at the middle thereof and a first circuit pattern formed therein and a second side substrate disposed on the first side substrate on the upper part of the base substrate on which the optical waveguide is formed; disposing an upper substrate on the side substrate on which the through hole is formed; and stacking the side substrate and the upper substrate on the base substrate on which the optical waveguide is formed.


Find Patent Forward Citations

Loading…