The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Jan. 24, 2007
Kiyoshi Hironaka, Shizuoka, JP;
Hideyuki Akiyama, Yamaguchi, JP;
Toru Hirohashi, Shizuoka, JP;
Katsuo Yamada, Shizuoka, JP;
Akihiro Fujii, Shizuoka, JP;
Kiyoshi Hironaka, Shizuoka, JP;
Hideyuki Akiyama, Yamaguchi, JP;
Toru Hirohashi, Shizuoka, JP;
Katsuo Yamada, Shizuoka, JP;
Akihiro Fujii, Shizuoka, JP;
FDK Corporation, Tokyo, JP;
Abstract
[Problems] To realize a structure that is substantially highly reliable, that solves a problem of a wire break accompanied by an application of an external force to a terminal and at the same time solves a problem of a wire break caused by heat effects during dip soldering, without causing a strength reduction of the terminal, cost increase, and wire thinning. [Means for Solution] A winding component in which a terminalis disposed in a protruding manner to a bobbinprovided with a winding portion, and a winding end is connected to the terminal, wherein a resin protrusionis formed integral with the bobbin at a foot of the terminal, the resin protrusion is shaped with a part of its circumference notched so that a side surface of the terminal partially juts out, and a wire material that is wound around the resin protrusion a plurality of times comes into contact with the terminal and is to be connected by dip soldering.