The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Feb. 25, 2008
Applicants:
James W. Getz, Blacksburg, VA (US);
David W. Sherrer, Radford, VA (US);
John J. Fisher, Taylors, SC (US);
Inventors:
James W. Getz, Blacksburg, VA (US);
David W. Sherrer, Radford, VA (US);
John J. Fisher, Taylors, SC (US);
Assignee:
Samsung Electronics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/04 (2006.01); H01L 29/06 (2006.01); H01L 29/40 (2006.01); H01L 21/4763 (2006.01); H01L 21/44 (2006.01); H01L 21/302 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided are electronic device packages and their methods of formation. The electronic device packages include an electronic device mounted on a substrate, a conductive via and a locally thinned region in the substrate. The invention finds application, for example, in the electronics industry for hermetic packages containing an electronic device such as an IC, optoelectronic or MEMS device.