The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Sep. 22, 2010
Felix Schinner, Emmendingen, DE;
Christian Joos, Ehrenkirchen, DE;
Wolfgang Hauser, Endingen, DE;
Michael Schmidt, Steinach, DE;
Thomas Burke, Freiburg, DE;
Felix Schinner, Emmendingen, DE;
Christian Joos, Ehrenkirchen, DE;
Wolfgang Hauser, Endingen, DE;
Michael Schmidt, Steinach, DE;
Thomas Burke, Freiburg, DE;
Micronas GmbH, Freiburg, DE;
Abstract
The invention relates to an electronic component having a semiconductor component, particularly a semiconductor chip, and at least one SMD component, a chip carrier with a support platform and with connecting leads. Whereby the semiconductor component, which is connected electrically via chip bonds to bond fingers of the connecting leads is mounted on the support platform and the SMD component connects the support platform to a connecting lead via contact surfaces arranged thereon, a housing, which encloses the semiconductor component, the SMD component, and at least partially the chip carrier. The support platform and the connecting lead in the area of the SMD component are profiled to create barriers in such a way that flowing of a free-flowing material from the contact surfaces connected to the SMD component of the chip carrier both onto the support platform and onto the connecting lead is prevented.