The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Sep. 05, 2008
Applicants:
Bum Chul Cho, Jeonju-si, KR;
Geun Ho Kim, Seoul, KR;
Sung Jin Son, Gwangju, KR;
Jin Soo Park, Gwangju, KR;
Inventors:
Bum Chul Cho, Jeonju-si, KR;
Geun Ho Kim, Seoul, KR;
Sung Jin Son, Gwangju, KR;
Jin Soo Park, Gwangju, KR;
Assignee:
LG Innotek Co., Ltd., Seoul, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 33/00 (2010.01); H01L 29/00 (2006.01); H01L 31/0288 (2006.01); H01L 31/112 (2006.01);
U.S. Cl.
CPC ...
Abstract
Provided is a light emitting device package and a method of fabricating the same. The light emitting device package comprises a package body having a cavity, a seed layer on a surface of the package body, a conductive layer on the seed layer, a mirror layer on the conductive layer, and a light emitting device in the cavity.
Cho, Bum. (2012). Lighting emitting device package and method of fabricating the same including a plating layer at an outer circumference of the package body (U.S. Patent No. 8203163). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8203163
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile