The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Sep. 04, 2008
Seon Goo Lee, Gyeonggi-do, KR;
Geun Chang Ryo, Gyeonggi-do, KR;
Dong Yeoul Lee, Gyeonggi-do, KR;
Yong Tae Kim, Gyeonggi-do, KR;
Young Jae Song, Gyeonggi-do, KR;
Seon Goo Lee, Gyeonggi-do, KR;
Geun Chang Ryo, Gyeonggi-do, KR;
Dong Yeoul Lee, Gyeonggi-do, KR;
Yong Tae Kim, Gyeonggi-do, KR;
Young Jae Song, Gyeonggi-do, KR;
Samsung LED Co., Ltd., Gyunggi-do, KR;
Abstract
Provided is a method of manufacturing an LED package, the method including preparing a mold die which includes an upper surface and a lower surface having an outer circumferential surface and a concave surface surrounded by the outer circumferential surface, the mold die having an outlet extending from the upper surface to the lower surface; preparing a base having a light emitting section formed therein; forming an inlet formed in a predetermined region of the base excluding the region where the light emitting section is formed; positioning the mold die on the light emitting section; forming a mold member by injecting a molding compound into the inlet of the base; and removing the mold die.