The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 19, 2012
Filed:
Mar. 04, 2009
James G. Neff, Felton, CA (US);
John E. Epler, San Jose, CA (US);
Stefano Schiaffino, Pleasanton, CA (US);
James G. Neff, Felton, CA (US);
John E. Epler, San Jose, CA (US);
Stefano Schiaffino, Pleasanton, CA (US);
Koninklijke Philips Electronics N.V., Eindhoven, NL;
Philips Lumileds Lighting Company, LLC, San Jose, CA (US);
Abstract
A compliant bonding structure is disposed between a semiconductor device and a mount. In some embodiments, the device is a light emitting device. When the semiconductor light emitting device is attached to the mount, for example by providing ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.