The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2012

Filed:

Dec. 23, 2008
Applicants:

Gwan-hyoung Lee, Suwon-si, KR;

Young-bee Chu, Yongin-si, KR;

Sang-hee Lee, Suwon-si, KR;

Jeong-seok OH, Seoul, KR;

Young-soo Kim, Seongnam-si, KR;

Wal-hee Kim, Yongin-si, KR;

Inventors:

Gwan-Hyoung Lee, Suwon-si, KR;

Young-Bee Chu, Yongin-si, KR;

Sang-Hee Lee, Suwon-si, KR;

Jeong-Seok Oh, Seoul, KR;

Young-Soo Kim, Seongnam-si, KR;

Wal-Hee Kim, Yongin-si, KR;

Assignee:

Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G02F 1/1345 (2006.01);
U.S. Cl.
CPC ...
Abstract

A printed circuit board (PCB) includes a base substrate, an electrical wiring, a dummy pad and a thermally conductive adhesion member. The base substrate includes a light-emitting diode (LED) mounted on a first surface of the base substrate. The electrical wiring is electrically connected to the LED. The dummy pad is formed on the first surface to be connected to the electrical wiring. The thermally conductive adhesion member is attached to a second surface of the base substrate. Therefore, superior heat radiation may be obtained, thereby reducing or preventing damage to the LED and the LCD device using the LED by radiating the heat from the LED used as a light source.


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