The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Nov. 14, 2009
Jung Eun Kang, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Hye Sook Shin, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Jung Eun Kang, Gyunggi-do, KR;
Seog Moon Choi, Seoul, KR;
Tae Hoon Kim, Gyunggi-do, KR;
Young Ki Lee, Gyunggi-do, KR;
Hye Sook Shin, Gyunggi-do, KR;
Chang Hyun Lim, Seoul, KR;
Samsung Electro-Mechanics Co., Ltd, Suwon, Gyunggi-Do, KR;
Abstract
Disclosed is a rigid-flexible circuit board, which includes a rigid region and a flexible region, the rigid region including a flexible substrate having a first circuit layer on both surfaces thereof, a metal core substrate formed on the flexible substrate and having a second circuit layer on both surfaces thereof, and an adhesive layer disposed between the flexible substrate and the metal core substrate, wherein the metal core substrate includes a metal core having a through hole, and an insulating layer formed on a surface of the metal core, so that the rigid region and the flexible region are thermally separated from each other and heat dissipation properties of the rigid region are improved. A method of manufacturing the rigid-flexible circuit board is also provided.