The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Dec. 14, 2007
Applicants:
Kenji Sasaoka, Tokyo, JP;
Yoshitaka Fukuoka, Tokyo, JP;
Inventors:
Kenji Sasaoka, Tokyo, JP;
Yoshitaka Fukuoka, Tokyo, JP;
Assignee:
Dai Nippon Printing Co., Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01); H01K 1/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
An electronic component built-in wiring board includes: at least a pair of wiring patterns; an insulating layer disposed between the pair of wiring board; an electronic component embedded in the insulating layer; and a metallic body provided at least on or above a main surface of the electronic component in the insulating layer and thermally contacted with the electronic component.
Sasaoka, Kenji. (2012). Electronic component built-in wiring board and method for radiating heat generated at the same (U.S. Patent No. 8198541). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8198541
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile