The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8198171 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 12, 2012

Filed:

Dec. 17, 2009
Applicant:

Hyung-hwan Kim, Gyeonggi-do, KR;

Inventor:

Hyung-Hwan Kim, Gyeonggi-do, KR;

Assignee:

Hynix Semiconductor Inc., Gyeonggi-do, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/76 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for fabricating a semiconductor device includes: providing a substrate; forming a plurality of trenches by etching the substrate; forming a first isolation layer by filling the plurality of the trenches with a first insulation layer; recessing the first insulation layer filling a first group of the plurality of the trenches to a predetermined depth; forming a liner layer over the first group of the trenches with the first insulation layer recessed to the predetermined depth; and forming a second isolation layer by filling the first group of the trenches, where the liner layer is formed, with a second insulation layer.


Find Patent Forward Citations

Kim, Hyung-Hwan. (2012). Semiconductor device and fabrication method thereof (U.S. Patent No. 8198171). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8198171

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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