The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2012

Filed:

Sep. 15, 2010
Applicants:

Hideya Murai, Tokyo, JP;

Tadanori Shimoto, Tokyo, JP;

Takuo Funaya, Tokyo, JP;

Katsumi Kikuchi, Tokyo, JP;

Shintaro Yamamichi, Tokyo, JP;

Kazuhiro Baba, Tokyo, JP;

Hirokazu Honda, Kanagawa, JP;

Keiichiro Kata, Kanagawa, JP;

Kouji Matsui, Tokyo, JP;

Shinichi Miyazaki, Kanagawa, JP;

Inventors:

Hideya Murai, Tokyo, JP;

Tadanori Shimoto, Tokyo, JP;

Takuo Funaya, Tokyo, JP;

Katsumi Kikuchi, Tokyo, JP;

Shintaro Yamamichi, Tokyo, JP;

Kazuhiro Baba, Tokyo, JP;

Hirokazu Honda, Kanagawa, JP;

Keiichiro Kata, Kanagawa, JP;

Kouji Matsui, Tokyo, JP;

Shinichi Miyazaki, Kanagawa, JP;

Assignees:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/44 (2006.01); H01L 21/48 (2006.01);
U.S. Cl.
CPC ...
Abstract

A wiring substrate for mounting semiconductors is provided with an insulation film, wires formed in the insulation film, and a plurality of electrode pads that electrically connect to the wires through vias. The electrode pads are provided to have their surfaces exposed to both of the front surface and the rear surface of the insulation film, and at least a part of the side surface of the electrode pads is buried in the insulation film. The insulation film is formed by forming electrode pads on the respective two metallic plates, thereafter, laminating an insulation layer and wires on the respective metallic plates to cover the electrode pad, and adhering the insulation layers to each other for integration, and thereafter, removing the metallic plates.


Find Patent Forward Citations

Loading…