The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2012

Filed:

Oct. 15, 2010
Applicant:

Saiki Yamamoto, Anan, JP;

Inventor:

Saiki Yamamoto, Anan, JP;

Assignee:

Nichia Corporation, Anan-shi, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/60 (2006.01);
U.S. Cl.
CPC ...
Abstract

The semiconductor devicecomprises a housingwhich has a recessin the front surface; a pair of lead electrodeswhich have the distal endsexposed in the recess, protrude from the external surface of the housing, and are bent along the bottom surfaceof the housing; and a semiconductor elementwhich is housed in the recessand is electrically connected to the pair of lead electrodes. The housinghas grooveswhich are formed on the pair of side surfaceswhich adjoin the front surfaceand the bottom surfaceon the right and left sides so as to penetrate the housingfrom the top surfacetoward the bottom surfaceof the housing. The groovespreferably have width substantially equal to the thickness of the lead electrode. The groovesare more preferably formed to be flush with the distal endsof the lead electrode


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