The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 12, 2012
Filed:
Sep. 15, 2009
Applicants:
Tae-seok Sim, Yongin-si, KR;
Dong-ho Lee, Yongin-si, KR;
Inventors:
Tae-Seok Sim, Yongin-si, KR;
Dong-Ho Lee, Yongin-si, KR;
Assignee:
Samsung Electronics Co., Ltd., Suwon-Si, Gyeonggi-Do, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B01L 3/00 (2006.01);
U.S. Cl.
CPC ...
Abstract
A biochip package body, a method of forming the same, and a biochip package including the biochip package body are provided. The biochip package body includes a mounting package body having a mounting plate. The mounting plate has at least one protruding portion that protrudes therefrom. The protruding portion has a chip mounting portion and a chip protection portion. The chip mounting portion is disposed substantially in the center of the protruding portion. The chip protection portion surrounds the chip mounting portion.