The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 12, 2012

Filed:

Mar. 15, 2010
Applicants:

Hyun Tae Kim, Suwon-si, KR;

Tae Sang Park, Seoul, KR;

Young Jun Moon, Hwaseong-si, KR;

Soon Min Hong, Seoul, KR;

Hyo Young Shin, Suwon-si, KR;

Inventors:

Hyun Tae Kim, Suwon-si, KR;

Tae Sang Park, Seoul, KR;

Young Jun Moon, Hwaseong-si, KR;

Soon Min Hong, Seoul, KR;

Hyo Young Shin, Suwon-si, KR;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01R 13/58 (2006.01);
U.S. Cl.
CPC ...
Abstract

Disclosed herein is a printed circuit board and a connecting method thereof. The connecting method of the circuit board assembly may include molding the printed circuit board assembly by applying a resin to the printed circuit board assembly, exposing ends of the electrode terminals of a connector mounted on a printed circuit board by partially removing the molded printed circuit board assembly, and connecting a connection member to the exposed ends of the electrode terminals of the connector. Therefore, even if the whole of the printed circuit board assembly is molded, the connection member may be freely connected to the connector of the printed circuit board assembly.


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