The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Jan. 07, 2008
Hark Byeong Park, Suwon-si, KR;
Byong Su Seol, Yongin-si, KR;
Hyung Geun Kim, Yongin-si, KR;
Hyun Ho Park, Daedeok-gu, KR;
Jong Sung Lee, Seoul, KR;
Hyung Seok Lee, Suwon-si, KR;
Young Jun Moon, Suwon-si, KR;
Hark Byeong Park, Suwon-si, KR;
Byong Su Seol, Yongin-si, KR;
Hyung Geun Kim, Yongin-si, KR;
Hyun Ho Park, Daedeok-gu, KR;
Jong Sung Lee, Seoul, KR;
Hyung Seok Lee, Suwon-si, KR;
Young Jun Moon, Suwon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, KR;
Abstract
Disclosed is a multilayer printed circuit board. The multilayer printed circuit board includes a power source surface to provide power to each component disposed on the power source surface, a ground surface having a reference voltage, a strip line which passes through the power source surface and/or the ground surface so as to transmit signals between components, an antenna installed in proximity to a sectional region of the power source surface and the ground surface, and an electromagnetic wave reduction member which is provided between the power source surface and the ground surface to effectively reduce an electromagnetic wave generated from the strip line.