The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 05, 2012

Filed:

Dec. 22, 2009
Applicants:

Kazuhiro Nagaoka, Tokyo, JP;

Tatemi Ido, Tokyo, JP;

Nobumasa Nishiyama, Kanagawa, JP;

Yuji Soga, Kanagawa, JP;

Inventors:

Kazuhiro Nagaoka, Tokyo, JP;

Tatemi Ido, Tokyo, JP;

Nobumasa Nishiyama, Kanagawa, JP;

Yuji Soga, Kanagawa, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G11B 5/55 (2006.01);
U.S. Cl.
CPC ...
Abstract

A head-stack assembly. The head-stack assembly includes: a magnetic-recording head; a lead-suspension supporting the magnetic-recording head on an actuator arm; a metal plate coupled with the actuator arm; a resin layer disposed on the metal plate; a flexible-printed-circuit board disposed on the resin layer, and substantially perpendicularly connected to the lead-suspension; a arm-electronics module disposed on the flexible-printed-circuit board configured to shape a write-signal current waveform of a write signal to said magnetic-recording head; transmission lines disposed on the flexible-printed-circuit board configured to transmit the write signal to, and a read-back signal from, the lead-suspension; and, a single intermediate conductor layer that is disposed between the resin layer and the flexible-printed-circuit board, and having a planar shape substantially facing a bottom of the arm-electronics module and a bottom of the transmission lines.


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