The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Apr. 08, 2005
John S. Wright, Minneapolis, MN (US);
Jagdish L. Agrawal, Minneapolis, MN (US);
Zine-eddine Boutaghou, Vadnais Heights, MN (US);
Joseph H. Sassine, Lakeville, MN (US);
Andrew D. White, Brooklyn Park, MN (US);
John S. Wright, Minneapolis, MN (US);
Jagdish L. Agrawal, Minneapolis, MN (US);
Zine-Eddine Boutaghou, Vadnais Heights, MN (US);
Joseph H. Sassine, Lakeville, MN (US);
Andrew D. White, Brooklyn Park, MN (US);
Seagate Technology LLC, Cupertino, CA (US);
Abstract
A support assembly includes a base layer, a circuit defined along the base layer, and a first material molded on at least a portion of the base layer. The first material substantially forms a shape of at least a portion of the support assembly. Further disclosed is a molded suspension assembly. The molded suspension assembly includes a thin and elongate metallic substrate and a non-metallic material molded along at least a portion of one side of the metallic substrate. The non-metallic material interlocks with the metallic substrate. The molded suspension assembly includes a transducer support area at or near a first end of the molded suspension assembly.