The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Sep. 10, 2009
Applicants:
Toshihiko Makino, Kanagawa, JP;
Atsushi Koyanagi, Tokyo, JP;
Inventors:
Toshihiko Makino, Kanagawa, JP;
Atsushi Koyanagi, Tokyo, JP;
Assignee:
Ricoh Company, Ltd., Tokyo, JP;
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/12 (2006.01);
U.S. Cl.
CPC ...
Abstract
A printed wiring board on which a package to be arranged, including: a first layer that is relatively rigid; and a second layer that is relatively flexible and on which the package is to be soldered, wherein an area other than a package arrangement area of the second layer is joined to the first layer by an adhesion layer.
Makino, Toshihiko. (2012). Printed wiring board, a method of manufacturing printed wiring board, a sensor module, and a sensing device (U.S. Patent No. 8193628). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8193628
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile