The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Mar. 03, 2010
Ruben P. Madrid, Talisay, PH;
Ruben P. Madrid, Talisay, PH;
Fairchild Semiconductor Corporation, South Portland, ME (US);
Abstract
A semiconductor die package is disclosed. The semiconductor die package includes a semiconductor die comprising an input at a first top semiconductor die surface and an output at a second bottom semiconductor die surface. A leadframe having a first leadframe surface and a second leadframe surface opposite the first leadframe surface is in the semiconductor die package and is coupled to the first top semiconductor die surface. A clip having a first clip surface and a second clip surface is coupled to the second bottom semiconductor die surface. A molding material having exterior molding material surfaces covers at least a portion of the leadframe, the clip, and the semiconductor die. The first leadframe surface and the first clip surface are exposed by the molding material, and the first leadframe surface, the first clip surface, and the exterior molding material surfaces of the molding material form exterior surfaces of the semiconductor die package.