The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Aug. 25, 2009
Jauder Jeng, Taichung, TW;
Man-lin Chen, Miaoli County, TW;
Pei-ching Liu, Miaoli County, TW;
Tien-shou Shieh, Taipei, TW;
Jauder Jeng, Taichung, TW;
Man-Lin Chen, Miaoli County, TW;
Pei-Ching Liu, Miaoli County, TW;
Tien-Shou Shieh, Taipei, TW;
Abstract
A sealant composition is provided. The sealant composition includes (a) an oligomer including an unsaturated mono-carboxylic acid modified bisphenol A epoxy resin and an unsaturated mono-carboxylic acid modified bisphenol F epoxy resin, wherein an equivalence ratio of the bisphenol A epoxy resin to the bisphenol F epoxy resin is 0.05:0.95 to 0.3:0.7, the bisphenol A epoxy resin has a melting point higher than 40° C. and the bisphenol F epoxy resin has a melting point lower than 40° C.; (b) an epoxy resin having at least two or more than two epoxy groups; and (c) a photoinitiator.