The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2012
Filed:
Jun. 19, 2002
Fumihiko Kawai, Kyoto, JP;
Toshiyuki Fukuda, Nagaokakyo, JP;
Masanori Minamio, Takatsuki, JP;
Noboru Takeuchi, Kyoto, JP;
Shuichi Ogata, Takatsuki, JP;
Katsushi Tara, Kyoto, JP;
Tadayoshi Nakatsuka, Suita, JP;
Fumihiko Kawai, Kyoto, JP;
Toshiyuki Fukuda, Nagaokakyo, JP;
Masanori Minamio, Takatsuki, JP;
Noboru Takeuchi, Kyoto, JP;
Shuichi Ogata, Takatsuki, JP;
Katsushi Tara, Kyoto, JP;
Tadayoshi Nakatsuka, Suita, JP;
Panasonic Corporation, Osaka, JP;
Abstract
The present invention includes a die pad; signal leads, ground connection leads connected to the die pad; a semiconductor chip including electrode pads for grounding; metal thin wires, and an encapsulating resin for encapsulating the die pad and the semiconductor chip and encapsulating the signal leads and the ground connection lead such that lower portions of the signal leads and the ground connection lead are exposed as external terminals. The ground connection lead is connected to the electrode pad for grounding, so that the resin-encapsulated semiconductor device is electrically stabilized. Furthermore, interference between high frequency signals passing through the signal leads can be suppressed by the die pad and the ground connection leads.