The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 8193026 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 05, 2012

Filed:

Dec. 09, 2009
Applicant:

Keun Hyuk Lim, Seoul, KR;

Inventor:

Keun Hyuk Lim, Seoul, KR;

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

A backside illumination (BSI) image sensor having a light receiving part at the wafer or die backside, and a manufacturing method thereof, are disclosed. The method includes polishing the light receiving part so that a super via protrudes, forming a first insulating layer to cover the protruding super via and the light receiving part, forming a photoresist pattern on the first insulating layer to expose a pad region, etching the first insulating layer to form spacers at sides of the protruding super via, repeatedly forming a second insulating layer covering the spacers, the super via and the light receiving part and etching the second insulating layer so that the spacers increase in width and cover an upper surface of the light receiving part, and forming a metal pad in the pad region to contact the super via.


Find Patent Forward Citations

Lim, Keun. (2012). Image sensor and method for manufacturing the same (U.S. Patent No. 8193026). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8193026

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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